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Microsoft Maia 200 AI Accelerator Debuts at Hot Chips
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Microsoft's Maia 200 AI accelerator, built on TSMC 3nm, packs 140 billion transistors, 750W TDP, and 10,000 TFLOPS FP4. The chip uses a software-defined dataflow architecture with 6 HBM3e stacks delivering 7TB/s bandwidth. Microsoft pairs it with unified Ethernet networking across 128 racks and 6,000 chips.
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