HardwareTom's Hardwareabout 1 hour ago
Bambu Lab Files Patent for New Heatbed
3 min read
Shenzhen Tuozhu Technology filed a patent application for a new heatbed design on September 10, 2026. The design aims to improve print adhesion and quality by using a monolithic aluminum body with a sunken channel for the heating element, potentially reducing peeling issues common in 3D printing.
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