StartupsTech.euabout 1 hour ago
Lightspring Raises €3.5M for Photonic Chip Packaging
4 min read
French deeptech startup Lightspring closed a €3.1 million seed round led by Atlantic and OVNI Capital, plus a €350,000 i-Lab grant, bringing total financing past €3.5 million. The company uses 3D lithography to print optical interfaces directly onto photonic chips, targeting coupling losses below 0.5 dB and design cycles under two weeks. Optical packaging accounts for roughly half a PIC's cost.
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