AIGSMArena1 day ago
TSMC CoPoS packaging cuts cost, boosts performance
1 min read
TSMC is developing CoPoS (Chip-on-Panel-on-Structure) packaging using a glass carrier and three-layer substrate. Mass production begins by end of 2028. Nvidia's Feynman AI chip will be the first to use CoPoS, which targets AI and high-performance computing chips to reduce manufacturing costs and improve performance.
Level
Hype check
Tap to vote and see what everyone thinks.
