ChipsTech in Asiaabout 4 hours ago
Huawei says new Kirin chip boosts transistor density
1 min read
Huawei's upcoming Kirin 2026 chipset, debuting in autumn 2026, will be the first to implement Logic Folding technology. It increases transistor density from 155 million to 238 million transistors per square millimeter, a 53.5% gain over the Kirin 9030 Pro baseline, based on the company's Tao (τ) Law.
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