AITom's Hardwareabout 2 hours ago
Intel XBM memory ditches HBM interposer
5 min read
An Intel patent reveals cross-batch memory (XBM), a new architecture that replaces HBM's costly silicon interposer with backend-transistor DRAM stacks connected via UCIe serial links. XBM aims to match HBM4's footprint while easing AI memory bottlenecks through built-in repair and lower packaging costs.
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