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Samsung and SK Hynix are upgrading their Chinese factories to make more advanced NAND memory chips, four people said. Samsung's Xian plant, about 40% of its global NAND output, targets 286-layer V9 chips at 5,000 wafers monthly in December, rising to 40,000 by December 2027. SK Hynix's Dalian site moves from 192 to 240 or more layers.
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