ChipsTechSpotabout 21 hours ago
ASML Targets 2033 for Larger-Mask High-NA EUV Upgrade
1 min read
ASML targets 2033 for High-NA EUV lithography with larger masks, promising a 40% productivity gain. The upgraded platform addresses the current version's smaller mask, which limits die area per exposure, while printing finer features than today's EUV tools for denser chip designs at advanced nodes.
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