AIThe Registerabout 2 hours ago
US AI Datacenter Growth Faces Chip Packaging Cap
7 min read
Satellite data shows US datacenter construction accelerating, with SynMax projecting capacity rising from about 11 GW in 2025 to 16-18 GW in 2026. But advanced chip packaging, mostly done in Taiwan, could cap 2027 deployment in the low 20s of gigawatts, far below the 80 GW some 2028 forecasts imply.
Level
Hype check
Tap to vote and see what everyone thinks.
