ChipsReutersabout 4 hours ago
Chip Packaging Investment Hits $28 Billion
6 min read
The AI boom drives a shift in semiconductor focus toward advanced chip packaging, with capital spending expected to approach $28 billion by 2026. Nvidia provides billions to SPIL for capacity expansion, while Powertech Technology plans a $400 million joint venture with Broadcom starting in 2028. TSMC develops its own panel technology, CoPoS, alongside its dominant CoWoS process.
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