#advanced packaging Tech News.
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ChipsTom's Hardwareabout 4 hours ago
Intel hires ex-SK hynix chief for foundry packagingIntel appointed former SK hynix CEO Seok-Hee Lee as executive vice president of Intel Foundry, overseeing advanced packaging, system integration, and back-end technology. Lee reports to CEO Lip-Bu Tan. Intel split advanced packaging into a dedicated business. Naga Chandrasekaran focuses on Intel 18A and 14A front-end nodes. Navid Shahriari retired after 37 years.
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