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The latest ballistic transport news, distilled by AI into sharp ~100-word summaries. ByteBrief tracks ballistic transport across dozens of tech sources and brings you only what matters, updated hourly. Tap any story for the full brief, or open the original source.

A joint research team experimentally observed ballistic transport in single-crystalline copper thin films at interconnect-relevant dimensions. The finding, published in Nature Communications, demonstrates that an industry-standard metal can achieve ballistic transport, potentially reshaping future chip wiring by reducing resistance and heat.
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