#chip packaging Tech News.
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The latest chip packaging news, distilled by AI into sharp ~100-word summaries. ByteBrief tracks chip packaging across dozens of tech sources and brings you only what matters, updated hourly. Tap any story for the full brief, or open the original source.
ChipsTom's Hardwareabout 2 hours ago
LG enters chip packaging with maskless LDI toolLG Electronics Production Technology Institute signed a contract to supply an OSAT with a maskless laser direct imaging lithography tool for semiconductor packaging. The machine patterns fine interconnects, trading resolution for higher throughput, while TSMC's CoWoS remains constrained.
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