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The latest cpo news, distilled by AI into sharp ~100-word summaries. ByteBrief tracks cpo across dozens of tech sources and brings you only what matters, updated hourly. Tap any story for the full brief, or open the original source.

AI cluster bandwidth demands are pushing optical connectivity from scale-out to scale-up links, moving interfaces closer to CPUs and GPUs. TSMC, Intel, Samsung, and GlobalFoundries are developing co-packaged optics (CPO) roadmaps to integrate optical interfaces directly into processor packages.
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