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TechPandailyabout 3 hours ago
HiSilicon Unveils NearLink SLE 3.0 at CEIC 2026Shanghai HiSilicon presented the NearLink SLE 3.0 evolution blue paper at the Consumer Electronics Innovation Conference 2026 in Shenzhen, held October 22 to 24. The company positions NearLink as a hard bus complementing OpenHarmony to connect simple IoT devices lacking useful connectivity and local intelligence.
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