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ChipsTom's Hardwareabout 3 hours ago
SMIC 7nm metal pitch beats Intel 18A but density lags 38%SemiAnalysis teardown of Huawei's HiSilicon Kirin 9030 finds SMIC's third-gen 7nm (N+3) has a 32.5nm minimum metal pitch, tighter than Intel 18A's 36nm on Panther Lake. However, N+3 transistor density of 113.4M/mm² trails 18A by 38%. SMIC achieved this without EUV using DUV quadruple-patterning.
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