ChipsTom's Hardwareabout 2 hours ago
TSMC Weighs 20% CoWoS Price Hike
4 min read
TSMC reportedly considers raising CoWoS packaging prices by 20% due to strained capacity from Nvidia Blackwell and Rubin chips. Equipment lead times stretch to eight months, while 2027 wafer prices may rise 5% to 10%. This potential hike affects AI hardware costs as demand accelerates.
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