AITom's Hardwareabout 3 hours ago
Intel Patent Embeds MicroLEDs in Chip Packaging
4 min read
Intel has been granted a U.S. patent, filed in 2022, for embedding MicroLEDs inside chip packaging using glass substrates and through-glass vias. The design could enable diagnostic testing, aesthetic lighting, and optical interconnects. AU Optronics is developing overlapping MicroLED optical communication for AI data centers, targeting a 10-meter range. No product has been announced.
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