ChipsThe Next Webabout 1 hour ago
SK Hynix breaks ground on $4B Indiana HBM packaging hub
1 min read
SK Hynix broke ground on a $4B high-bandwidth memory packaging plant in West Lafayette, Indiana, its first US base, with mass production due in the second half of 2029. The CHIPS Act provides up to $458M in direct funding and $500M in loans. Intel cancelled its similar €4.6B plant near Wroclaw in July 2025.
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