AIServeTheHomeabout 2 hours ago
SK hynix HBM Packaging at Hot Chips 2026
1 min read
SK hynix's Hot Chips 2026 presentation detailed HBM packaging, covering 3D stacking, bonding, and system integration. HBM4 doubles bandwidth to 2048 GB/s across 2048 IOs, with 48 GB capacity. Hybrid bonding is positioned as the path to 20-plus-high stacks, with i-HBM targeting over 30 percent thermal resistance reduction.
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