ChipsTom's Hardwareabout 1 hour ago
GlobalFoundries Signs $2 Billion Deal With TSMC
5 min read
GlobalFoundries and TSMC have entered into a five-year manufacturing agreement valued at $2 billion. GlobalFoundries will produce silicon interposers for TSMC's CoWoS technology in the US starting in the first half of 2028. This deal establishes a domestic source for advanced packaging components needed for AI and high-performance computing processors.
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