TechPandailyabout 2 hours ago
HiSilicon Unveils NearLink SLE 3.0 at CEIC 2026
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Shanghai HiSilicon presented the NearLink SLE 3.0 evolution blue paper at the Consumer Electronics Innovation Conference 2026 in Shenzhen, held October 22 to 24. The company positions NearLink as a hard bus complementing OpenHarmony to connect simple IoT devices lacking useful connectivity and local intelligence.
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