ChipsTom's Hardwareabout 2 hours ago
Hybrid bonding advances at TSMC, Intel; HBM4 delay
9 min read
Hybrid bonding is in high-volume production on logic chips but postponed for memory. TSMC scaled SoIC bond pitch to 6 microns, targeting 4.5 by 2029. Intel shipped Foveros Direct in Clearwater Forest. A JEDEC decision raised HBM stack-height limits, delaying HBM4's adoption of the technique.
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