ChipsTom's Hardwareabout 1 hour ago
GlobalFoundries Targets 2030 for FDX Fusion
17 min read
GlobalFoundries VP Sudipto Bose details FDX Fusion technology, promising 7nm-class performance without EUV tools. The company targets 2030 for high-volume manufacturing, utilizing advanced planar transistors. Bose notes 8nm-class logic density and 500 GHz fT/fmax performance for connectivity and edge AI applications.
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