ChipsTom's Hardwareabout 1 hour ago
Micron Plans Wafer Bonding and High-NA EUV
5 min read
Micron plans to use wafer bonding with its upcoming 1ε DRAM process and adopt High-NA EUV lithography for subsequent generations. The company also develops vertical high-bandwidth memory and vertical edge inference memory. Scott DeBoer states 3D DRAM will launch when cost and performance advantages are sufficient.
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