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Samsung, Qualcomm Develop Organic Bridge AI Chip Tech | ByteBrief

ChipsTechRadarabout 1 hour ago

Samsung, Qualcomm Develop Organic Bridge AI Chip Tech

4 min read

Samsung and Qualcomm are collaborating on 2.1D chip packaging using an organic bridge material. This technology aims to reduce AI processor fabrication costs and improve bandwidth compared to traditional 2.5D packaging.

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In this storyQualcomm Samsung

#semiconductors #ai #packaging #samsung #qualcomm

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