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SK hynix HBM Packaging at Hot Chips 2026
SK hynix VP Jaesik Lee said at Hot Chips 2026 that hybrid bonding won't be ready for HBM4E, pushing the transition to HBM5. The 775-micron thickness cap and thermal challenges keep MR-MUF viable, while iHBM cooling targets over 30 percent thermal resistance reduction.
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