#cowos Tech News.
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AITom's Hardwareabout 4 hours ago
TSMC: Panel packaging won't replace CoWoS for AI chipsTSMC stated at its European Technology Symposium that panel-level packaging will not replace wafer-level CoWoS for large AI processors. Wafer-level technology can scale to integrate 58 massive dies in one package. Panel-based processes lack the interconnection density of wafer-level tech, according to senior vice president Kevin Zhang.
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