ChipsTom's Hardwareabout 1 hour ago
TSMC, Samsung, Intel Back ASML's Larger Photomask Push
6 min read
ASML, Intel, Samsung, and TSMC are collaborating to transition the semiconductor industry to 6×12-inch photomasks. The larger reticles are required for High-NA EUV lithography to print large chips in a single pass, eliminating the need to stitch smaller designs together.
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