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SemiAnalysis found SMIC's third-gen 7nm-class N+3 node has smaller metal pitch than Intel 18A and transistor density higher than TSMC N6, all without EUV lithography. The node powers Huawei's Kirin 9030 SoC. Despite these metrics, N+3 does not match Intel 18A or TSMC N2 and N3 in competitiveness.
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