
SK Hynix began shipping 12-layer HBM4E samples to major AI customers. The 48GB stack runs at up to 16Gbps per pin with over 20% improved power efficiency over the previous generation. The company used Advanced MR-MUF packaging for structural stability and 17% better heat resistance.
Tap to vote and see what everyone thinks.
Summary by ByteBrief
TSMC CoPoS packaging cuts costs, boosts AI chip performance