AITom's Hardwareabout 1 hour ago
CPO roadmaps: TSMC, Intel, Samsung, GlobalFoundries
13 min read
AI cluster bandwidth demands are pushing optical connectivity from scale-out to scale-up links, moving interfaces closer to CPUs and GPUs. TSMC, Intel, Samsung, and GlobalFoundries are developing co-packaged optics (CPO) roadmaps to integrate optical interfaces directly into processor packages.
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