ChipsTom's Hardwareabout 2 hours ago
LG enters chip packaging with maskless LDI tool
6 min read
LG Electronics Production Technology Institute signed a contract to supply an OSAT with a maskless laser direct imaging lithography tool for semiconductor packaging. The machine patterns fine interconnects, trading resolution for higher throughput, while TSMC's CoWoS remains constrained.
Level
Hype check
Tap to vote and see what everyone thinks.
In this storyTSMC
Summary by ByteBrief
